(module "10118192-0001LF(MICRO-USB-B-AMPHENOL-FCI)" (layer F.Cu) (tedit 200000)
  (attr smd)
  (fp_text reference >NAME (at -1.20904 -4.05638) (layer F.SilkS))
  (fp_text value >VALUE (at 5.6896 -1.59766 90) (layer F.SilkS))
  (fp_text user "Edge of PCB" (at 1.397 1.47066) (layer F.SilkS))
  (pad CGND smd rect (at -3.79984 0) (size 1.79832 1.89992) (layers F.Cu F.Paste F.Mask))
  (pad CGND smd rect (at -1.19888 0) (size 1.89992 1.89992) (layers F.Cu F.Paste F.Mask))
  (pad CGND smd rect (at 1.19888 0) (size 1.89992 1.89992) (layers F.Cu F.Paste F.Mask))
  (pad CGND smd rect (at 3.79984 0) (size 1.79832 1.89992) (layers F.Cu F.Paste F.Mask))
  (pad CGND smd rect (at 3.0988 -2.54762) (size 2.09804 1.59766) (layers F.Cu F.Paste F.Mask))
  (pad CGND smd rect (at -3.0988 -2.54762) (size 2.09804 1.59766) (layers F.Cu F.Paste F.Mask))
  (pad D+ smd rect (at 0 -2.67462) (size 0.39878 1.34874) (layers F.Cu F.Paste F.Mask))
  (pad D- smd rect (at -0.6477 -2.67462) (size 0.39878 1.34874) (layers F.Cu F.Paste F.Mask))
  (pad GND smd rect (at 1.29794 -2.67462) (size 0.39878 1.34874) (layers F.Cu F.Paste F.Mask))
  (pad ID smd rect (at 0.6477 -2.67462) (size 0.39878 1.34874) (layers F.Cu F.Paste F.Mask))
  (pad VBUS smd rect (at -1.29794 -2.67462) (size 0.39878 1.34874) (layers F.Cu F.Paste F.Mask))
)
